OnChip Introduces an Extremely Versatile Designer Friendly Thin Film Wire-bondable Silicon Resistor Chips for Medical, Aerospace, Military, Communication, and Instrumentation Applications

Santa Clara, CA – A global leader in Integrated Passive Devices (IPD), OnChip today introduced a miniature Thin Film Silicon wire-bondable Resistor Chip that can offer a wide range of values. Using advanced thin-film manufacturing techniques and featuring high-stability, self-passivating and moisture-resistant Tantalum Nitride resistor elements, this product is ideal for developing quick-turn proto-types in the hybrid microelectronics labs. The multi-tapped 110R Series Resistors provide great flexibility to hybrid circuit designers. Consisting of a string of 20 resistors, these chips can be wire-bonded to offer a wide range of resistances. Measuring a size of 34 x 34 mils sq., the 110R consists of twenty one wire-bond pads. There are a set of 10 resistors with a value of 2.5k-ohms each and another set of 10 resistors with a value of 25k-ohms each, adding up to a total resistance of 275k-ohms. Since all these resistors are in series and with pads between each, the designer can get any values from 2.5k-ohms to 275k-ohms depending on what wire-bond pads are used. The 110R resistors offer TCR (Temperature Coefficient of Resistance) value as low as 250 ppm/°C. TCR Tracking between individual resistors are no more than 10 ppm/°C. . Additionally, these devices provide low shunt capacitance and low-noise operation which are ideal attributes for use in high performance hybrid microelectronics.

These silicon resistor chips feature resistance to thermal shock and high-temperature exposure. They are 100% electrically tested and visually inspected to MIL-STD-883. They are specified for an operating temperature range of -55°C to +125°C.

Availability and Pricing
The 110R thin film resistor chips are available immediately worldwide. These devices have production pricing in the range of $3.90 to $7.25, depending on the device tolerance and volume. While samples are available immediately, there is a lead-time of 6 weeks for production quantities. Developed at the OnChip Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.