OnChip Adds Thin Film Resistor and R-C Capabilities for Customer Specific Applications

OnChip Offers Application Specific Semi-Custom and Full-Custom Precision Silicon Resistors and Resistor-Capacitor Networks

Santa Clara, CA – A global leader in Integrated Passives, OnChip Devices today announced the ability to develop and build semi-custom and full-custom Silicon based Resistor and Resistor-Capacitor Arrays using its proprietary Thin Film Process Technology. The circuit schematic can be Application specific and can include a wide range of resistor and capacitor values, tight resistor tolerances, and complex interconnections. These arrays can be manufactured from design concept to working samples in less than 8 weeks.

Customers can replace discrete Resistors and Capacitors into a single monolithic silicon circuit to match their product needs. These R and R-C arrays can provide significant cost as well as PCB board-space savings. OnChip’s proprietary Thin Film Process offers Resistors featuring superior electrical stability and higher precision while maintaining a miniature size.


  • Resistances from 1 Ohm to 100MegOhm

           o Tight tolerances to 0.1%, precision matching, high stability, and low TCR, VCR
           o Exceptional voltage and power handling capabilities

  • Capacitors ranging from 2pF to 2,000pF


  • System in Package (SIP)
  • RF/Communication
  • Medical
  • Scientific
  • Industrial
  • Military

These products are offered as bare-die or in standard Semiconductor IC Packages such as SC70, SOT, TDFN, uDFN, SOIC, QSOP, MSOP, TSSOP and DIP. All devices are 100% electrically tested and products shipped as bare-die are visually inspected to MIL-STD-883. All of these devices are operational in the full military temperature range of –55°C to +125°C.

Availability and Pricing

The custom thin film resistance network capability is available immediately at a Non-recurring engineering (NRE) charges ranging from $4,500 to $7,500 depending on the design complexity of the device. Products are shipped either in wafer-form, bare-die or as packaged products and can be built in 6 to 8 weeks. These components are designed and developed at OnChip Devices’ Santa Clara facility and are produced to the highest quality standards.

About OnChip Devices

OnChip Devices is headquartered in Santa Clara, CA and is a global leader in Integrated Passive Devices. With its own silicon fabrication facility and strong partnerships with full turnkey assembly and test houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High Brightness LED, Computing, and Consumer Electronics.