OnChip Devices Introduces Low Capacitance Diode Arrays for RF Antenna ESD Protection

Packaged in miniature 3-pin SOT23 these ESD diodes are specifically designed to provide contact discharge protection for RF Antennas at levels as high as 8kV when tested to IEC61000-4-2 International Standards

Santa Clara, CA – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a miniature diode array with very low input capacitance and high protection levels from electrostatic discharge (ESD) for RF Antennas. Wireless devices can be susceptible to ESD events through the Antenna. The ESD pulse can be introduced directly into the RF Switch and Amplifier Circuit. Without sufficient protection, these ICs can be rendered inoperable since they are routinely manufactured using sub-micron technologies. These small geometries are extremely sensitive to ESD. The OC1214-01TR consists of a set of 5 diodes that combine to safely dissipate ESD strikes of ±8kV contact discharge per the stringent requirements of the IEC 61000-4-2 international standard. Despite the exceptionally high ESD level, these devices exhibit a very low input capacitance of under 1pF, thereby preventing signal degradation for the high-speed lines.

OC1214 PR Image

OnChip’s new RF Antenna protection diodes are designed for applications requiring signal swing above and below ground with a maximum working voltage of up to ±7V. Battery-powered portable consumer electronics will greatly benefit from these diodes as they have extremely low leakage currents – down to 0.1uA (at 5V). With data serialization, higher bit rates, and increasing screen resolutions, today’s consumer products require uncompromising levels of protection against ESD with ultra-low line capacitance to preserve signal integrity. Protecting these systems with OnChip’s silicon based diodes has become an essential part of the product’s reliability.

“Protecting the RF Antenna circuit in mobile electronics offer many challenges to the designer engineers. The ESD Protection Diodes have to handle bi-directional signals while maintaining very low loading capacitance and clamp voltage. The OC1214-01TR diodes offer a perfect solution by addressing all these issues.” said Ashok Chalaka, President & CEO. “OnChip is already shipping ESD diode array ESD2100 for the USB and HDMI ports and OC1214-02MR for the Ethernet port protection. We are pleased to add the RF Antenna protection circuit to our ever expanding product portfolio.” OnChip has been making new product announcements at the rate of one per month over the past year and a half. Like all diode arrays offered by OnChip, the OC1214 protects against multiple ESD strikes without degradation in product effectiveness.

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Availability and Pricing
The OC1214-01TR is available immediately worldwide and the production pricing is under $0.09 depending on volumes. Developed at OnChip Devices’ Santa Clara facility, these components are produced to the highest quality standards. Please contact sales@onchip.com for a quote or additional information.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing, and Consumer Electronics.

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OnChip Introduces Thin Film Precision Silicon Chip Resistors for Hi-Rel Applications

OnChip Introduces a family of high reliability Thin Film wire-bondable Silicon Resistor Chips for Medical, Aerospace, Military, Communication, and Instrumentation Applications

Santa Clara, CA – A global leader in Integrated Passives Devices (IPD), OnChip today introduced a family of Thin Film Silicon wire-bondable Resistor Chips. These products use sophisticated thin-film manufacturing process featuring a high-stability, self-passivating and moisture-resistant Tantalum Nitride resistor element. Consisting of a single and dual value resistors, these chips offer a very wide range of resistances and tolerances. Additionally, these devices provide low shunt capacitance and low-noise operation which are ideal attributes for use in high performance hybrid microelectronics. The single value resistors TX & TL Series Resistors have a very small die size of 20 x 20 mils. Sq.. The TX resistors are offered in single wire bond configuration while the TL requires two wire bonds. The center-tapped TR Series Resistors provide greater flexibility to hybrid circuit designers. Measuring a size of 30 x 30 mils sq., the TR consists of six bond pads enhancing layout flexibility. It also offers users three resistor value choices – total value, one-half value, or one-quarter value – depending on the wire-bond configuration. The TR resistors offer a wide resistance range of 4.7ohms to 1Meg-ohms with tight tolerances down to 0.5% and TCR values as low as 25 ppm/°C. TCR tracking between resistor halves is 5 ppm/°C.

Electrically tested and visually inspected to MIL-STD-883, these silicon resistor chips feature resistance to thermal shock and high-temperature exposure. They are specified for an operating temperature range of -55°C to +125°C. 

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Availability and Pricing
TLTR, and TX thin film resistor chips are available immediately worldwide. These devices have production pricing in the range of $0.24 to $3.25, depending on the device type and volume. While samples of all devices are available immediately, please expect lead-times of 6 weeks for production quantities. Developed at the OnChip Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing, and Consumer Electronics.

 

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OnChip Introduces ESD Protection Diode Designer Kit

OnChip extends Industry Leadership by offering the first ever ESD protection Diode Designer Kit

Santa Clara, CA – A global leader in Integrated Passives Devices (IPD), OnChip announced the availability of an Eletrostaic Discharge (ESD) Protection Diode Kit to help designers reduce their time-to-market. The OC-ESD-DK1 is a First Edition Designer Kit and it offers a wide assortment of ESD protection diodes for various applications such as high speed I/O ports and systems that require 30kV contact discharge protection when tested to IEC61000 specifications.

Portable devices such has Mobile Handsets, PC/Notebooks, MP3 Players, PDAs, etc. are becoming increasingly susceptible to ESD failures since they predominantly use integrated circuits (IC) with sub-micron geometries and low working voltages. Protecting these devices with silicon based TVS diodes have become an essential part of the product’s reliability. However, due to time and resource limitations, the proper selection of ESD protection diodes is often overlooked until the very end of the design cycle. At that point, space becomes a major contraint and the designers may be forced to compromise system performance. Having access to an ESD Designer Kit that offers a large selection to Transient Voltage Supressor (TVS) devices will be extremely vital to the success of the product.

“Our one-of-a-kind ESD Engineering Kit significantly reduces the design time for the fast paced Consumer Electronics and Computing products,” said Ashok Chalaka, President and CEO of OnChip. “By offering a wide range of low-capacitance as well as high protection level diodes in various package options, OnChip enables the designers to select the ideal component for their Electromagnetic compatibility (EMC) conformance.”

The OC-ESD-DK1 Designer Kit consists of 12 different products including low-capacitance devices, I/O port specific products and industry leading 30kV contact ESD protection diodes as well as the smallest available 0201-size Flip Chip components. Each product type has 10 to 20 samples for breadboarding and quick engineering evaluation. Many of the components are built using industry standard SOT, SC70, MSOP and DFN packages and the number of channels offered range from 1 to 8 per device. Some of the devices have an overall thickness of less than 0.5mm which make them ideal for height sensitive product enclosures. All 12 products included in this first generation kit are currently shipping globally and in production volumes.

Availability and Pricing
The OC-ESD-DK1 ESD Protection TVD Diode Designer Kits may be purchased directly from OnChip or from a large network of franchised Distributors worldwide. These devices have a suggested retail price of $250.00. Developed at the OnChip Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With full access a local silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing, and Consumer Electronics.

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OnChip Introduces miniature CSP EMI Filter Arrays with ESD Diodes for mobile handsets

OnChip Introduces a family of EMI Filter Arrays with Built-in ESD Diode Protection in Miniature and Low Profile Chip Scale Packages

Santa Clara, CA – A global leader in Integrated Passives Devices (IPD), OnChip today introduced a family of electromagnetic interference (EMI) low-pass RC Pi filter arrays with on-board diodes for electrostatic discharge (ESD) protection. Offered in Flip Chip style Chip Scale Packages (CSP), these devices are specifically designed for high-speed data LCD and memory card interfaces in mobile phones, PDAs and MP3 players. They provide superior electrical performance across a wide frequency range as well as significant board space savings.

The OC1425 is a 4-channel EMI filter while the EMF4020 and the OC1442 are 8-channel EMI filter arrays. All three devices are designed to reject rerouted and retransmitted radiation frequencies on the lines between the graphics controller and the LCD. Designed with line capacitances that support up to 30MHz frequencies and minimize impact on the rise and fall times of video signals, these devices are capable of attenuating unwanted signals over the RF band between 800MHz and 3GHz. Additionally, they have built-in Zener diodes that protect the LCD controller and the I/O ports against damage from ESD of up to 15kV rated to meet IEC61000-4-2 standard level 4 ESD requirements.

These filters are offered in a flip-chip package, reducing board space and also minimizing the package parasitics thereby delivering excellent S21 characteristics with extremely low parasitic inductance (10 pH). They have a very low profile of 0.65 mm or less than 0.03 inches.

OnChip has also introduced EMF1402 for SIM (Subscriber Identity Module) Card I/O port and EMF1423 for Secure Digital (SD) Card I/O port EMI Filtering and ESD protection used in mobile devices. These devices are also offered in the same low-profile CSP format.

Availability and Pricing
OC1425, OC1442, EMF4020, EMF1402 and EMF1423 filter arrays are available immediately worldwide. These devices have production pricing in the range of $0.11 to $0.25, depending on the device type. Developed at the OnChip Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing, and Consumer Electronics.

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OnChip ESD0402 Press Release

OnChip Introduces Ultra Small 1-channel ESD Protection TVS Diodes in 0402 Size Molded Plastic Packages

Packaged in miniature 2-lead DFN (SMD) these ESD diodes are specifically designed to provide contact discharge protection for portable consumer electronics at levels as high as 8kV when tested to the IEC61000-4-2 International Standard

Santa Clara, CA, July 31, 2008 – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a miniature diode with a case size of 0402 or 1mm x 0.6mm and with a package height of 0.5mm. The ESD0402-01FR has back-to-back diodes for bi-directional AC signals and is designed for use in +/-5V environment. It can safely dissipate ESD strikes of ±8kV contact discharge per the requirements of the IEC 61000-4-2 international standard. The small size DFN-2 package makes this device ideal for space sensitive portable electronics such as Cell Phones, Digital Cameras, PDAs, MP3 players and GPS Handsets. At less than 1uA, its leakage current is among the lowest in the industry. This is an important factor in battery-powered portable devices,. The diode also offers a low breakdown voltage of 9V (typical) and reliably protects electronics systems against transients and ESD events. It is compliant with RoHS 2002/95/EC and WEEE 2002/96/EC.

“Miniaturization continues to be a key factor in consumer electronics and OnChip has become a significant partner to major OEMs worldwide in developing state-of-the-art ESD products to meet their stringent needs.” said Ashok Chalaka, President & CEO on OnChip Devices. “Our diodes offer small footprints and maximum reliability to ensure their systems are properly protected against ESD and Transient Voltages. At OnChip, we are setting the standards in the industry by offering diodes that are the smallest with the highest levels of ESD protection.”

Availability and Pricing
The OnChip ESD0402-01FR is available immediately worldwide and the production pricing is $0.035. Developed at OnChip Devices’ Santa Clara facility, these components adhere to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

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OnChip OC1214 Press Release

OnChip Devices Introduces Low Capacitance Diode Arrays for Ethernet I/O Port ESD Protection

Packaged in miniature MSOP-8 (SMD) these ESD diodes are specifally designed to provide contact discharge protection for Fast Ethernet and Gigabit Ethernet I/O ports at levels as high as 8kV when tested to IEC61000-4-2 International Standard

Santa Clara, CA, June 30, 2008 – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a miniature diode with very low input capacitance and high protection levels from electrostatic discharge (ESD) for the Ethernet Port: 10/100/1000Mb/s. PCI adapter cards, hubs, routers, etc. can be susceptible to ESD events when the cable is disconnected from the Ethernet port. The ESD pulse can be introduced directly into the open port, or into the disconnected end of the cable. Without sufficient protection, the Physical Layer Transceivers (PHY) and the Controller chips can be rendered inoperable since they are routinely manufactured using 0.18-micron and 0.13-micron technologies. These small geometries are extremely sensitive to ESD. The OC1214-02MR has back-to-back diodes for AC signals and can safely dissipate ESD strikes of ±8kV contact discharge per the requirements of the IEC 61000-4-2 international standard. Despite the exceptionally high ESD level, this device exhibits a very low input capacitance of under 1pF, thereby preventing signal degradation for the high speed lines.

With data serialization, higher bit rates, and increasing screen resolutions, today’s computers and consumer products require uncompromising levels of protection against ESD with ultra-low line capacitance to preserve signal integrity. Protecting these systems with OnChip’s silicon based diodes has become an essential part of the product’s reliability. OC1214-02MR offers channel-to-ground capacitance of less than 1pF and the channel-to-channel capacitance of under 0.4pF. The device clamp voltage is below 10V which virtually eliminates IC latch-up and soft errors.

“Protecting the Ethernet port offers many challenges: The signal is bipolar, the capacitance loading has to be minimal, the clamp voltage has to be low and the ESD protection level has to be very high. The OC1214-02MR diode offers a perfect solution by addressing all these issues.” said Ashok Chalaka, President & CEO. “OnChip is already shipping ESD diode arrays (ESD2100) for the USB and HDMI protection. We are pleased to add the Ethernet protection circuit to our ever expanding product portfolio. This is OnChip’s eighth consecutive month with a major product announcement.”

Availability and Pricing
The OnChip OC1214-02MR is available immediately worldwide and the production pricing is $0.19. Developed at OnChip Devices’ Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

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OnChip ESD2200 Press Release

OnChip Devices introduces TVS Diode Arrays with the Highest ESD Protection Level Available in the Industry

Packaged in miniature SOT23, SOT143 & SC70 (SMD) these ESD TVS diodes are ideally suited for space sensitive applications requiring contact discharge protection as high as 30kV when tested to IEC61000-4-2 Internation Standards

Santa Clara, CA, May 30, 2008 – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a family of miniature TVS diodes with very high protection levels from electrostatic discharge (ESD). The ESD2200 device safely dissipates ESD strikes of ±30kV contact discharge, well beyond the maximum requirements of the IEC 61000-4-2 international standard. It is offered in 2, 3, 4, and 5 channels and has superior electrical performance. In spite of the exceptionally high ESD level, this device exhibits a relatively low input capacitance of under 20 pF. This diode capacitance also provides some EMI filtering, when used in combination with a PCB trace or series resistor.

Portable devices such has Mobile Handsets, PC/Notebooks, MP3 Players, PDAs, etc. are becoming increasingly susceptible to ESD failures since they predominantly use integrated circuits (IC) with sub-micron geometries and low working voltages. Protecting these devices with silicon based ] TVS diodes has become an essential part of the product’s reliability. ESD2200 offers clamp voltage as low as 10V which virtually eliminates IC latch-up and soft errors.

“The introduction of the ESD2200 diodes is another significant highlight in OnChip’s brief history. Within a very short span, we have established ourselves as an industry leader in Integrated Passive Devices.” said Ashok Chalaka, President & CEO. “OnChip continues to rapidly increase it’s product portfolio in the ever expanding ESD protection market. We have launched a major product every month since November 2007 and we plan to continue with our aggressive product roadmap.”

Availability and Pricing
The OnChip ESD2200 is available immediately worldwide and the production pricing ranges from $0.06 to $0.15 depending on the number of channels and the package type. Developed at OnChip Devices’ Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

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OnChip SiC0101 Press Release

OnChip Introduces World’s Smallest and Thinnest Wire-bondable Silicon Capacitors

Silicon Nitride Capacitor as small as 10 x 10 mils sq (0.25mm x 0.25mm) and thickness as low as 4 mils (0.1mm) offers excellent electrical characteristics

Santa Clara, CA, April 30, 2008 – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a wire-bondable miniature silicon chip capacitor targeted for RF Microwave, Multichip Module and Hybrid Microelectronics applications. OnChip’s SiC0101 device is built on silicon with a single wire-bondable pad on the top and metallization on the backside of the chip suitable for epoxy die attach. A layer of Silicon Nitride dielectric film is sandwiched between these two metal plates to form the capacitor. OnChip’s high quality dielectric is deposited using proprietary processes to achieve capacitance values of 4.7pF to 22pF. This dielectric material offers high stability and Q values while exhibiting low temperature and voltage coefficients.

Compared to conventional RF capacitors, OnChip’s SiC0101 offers extremely stable capacitance over a wide range of frequencies from 1MHz to several GHz. Additionally, their semiconductor construction provides an ultra-high Self-Resonant Frequency (SRF) and exceptionally low Equivalent Series Resistance (ESR). Typical applications for the SiC0101 capacitor include voltage-controlled oscillators, filter networks, matching networks in modules for wireless communications including mobile phones, cordless phones, and global positioning systems.

Intended to save space while providing superior electrical performance, OnChip’s SiC0101 single-wire capacitor is only 250um x 250um (10mils x 10mils or 0.25mm x 0.25mm) in size and is available as thin as 100um (4mils or 0.1mm). Other thicknesses (6mils and 8mils) are also available in this foot print. The wire bondable top pad consists of either Aluminum or Gold metallization. Back metal is typically Gold.

OnChip recently announced miniature EMI Filter products for Mobile application as well as ESD protection diodes for HDMI and USB ports as well as High Brightness LEDs. Several other ESD and EMI filter products as well as precision resistor networks are in the pipleline.

Availability and Pricing
The OnChip SiC0101 is available immediately worldwide at a price range of $0.01 to $0.02 USD (depending on capacitance value/tolerance and the chip thickness) in quantities of 50,000. These components are designed and developed at OnChip Devices’ Santa Clara facility and are produced to the highest quality standards.

About OnChip Devices
OnChip Devices is head-quartered in Santa Clara, CA and is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-keys assembly and test houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

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OnChip EMF110x Press Release

OnChip Introduces miniature EMI Filter Arrays with ESD Diodes for mobile handsets

OnChip Introduces a broad family of EMI Filter Arrays with Built-in ESD Diode Protection in Miniature and Low Profile Packages

Santa Clara, CA, April 1, 2008 – A global leader in Integrated Passives, OnChip Devices today introduced a family of electromagnetic interference (EMI) filter arrays with on-board electrostatic discharge (ESD) protection in various TDFN and uDFN package options. Specifically designed for high-speed data interfaces in mobile phones, this EMF110x family is offered in 4-channel, 6-channel and 8-channel filter arrays. They provide superior electrical performance and significant board space savings.

The EMF110x delivers excellent S21 characteristics with extremely low parasitic inductance (10 pH) due to the package ground pad. These devices are capable of attenuating unwanted signals over RF band between 800 MHz and 2.9 GHz. Additionally, the EMF110x provides ESD protection up to +/-15kV contact discharge per IEC61000-4-2 Level 4 specifications.

“While OnChip continues to set the space in the industry for new products, the introduction of the EMF110x clearly establishes us as a broad-based supplier of integrated passive devices,” said Ashok Chalaka, OnChip Devices’ President and CEO. “The primary applications for these new EMI filters are high resolution color displays and mega pixel camera interfaces in the next generation smaller and thinner cellular phones and PDAs.”

These packaged devices offer higher reliability with respect to handling and solderability compared to both Chip Scale Packages and discrete filters. Each EMF110x device features an application-specific cut-off frequency (105 MHz to 210 MHz) and is optimized for LCD displays and Camera interfaces. The TDFN package has a thickness of 0.75mm and is offered in both the 0.4mm and 0.5mm pad-pitch. The uDFN package has a thickness of 0.5mm and a pad-pitch of 0.4mm.

Availability and Pricing
The OnChip EMF1100, EMF1101, EMF1102 and EMF1103 products are available immediately worldwide. These devices have production pricing in the range of $0.09 to $0.21, depending on the package type and the number of filter channels. Developed at OnChip Devices’ Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

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OnChip ESD0201 Press Release

OnChip Introduces the World’s Smallest ESD Protection Diode in Flip Chip format

0201 case-size silicon-based surface-mount (SMD) ESD TVS diode is ideally suited for space sensitive applications requiring contact discharge protection as high as 30kV

Santa Clara, CA, February 1, 2008 – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced the smallest SMD ESD protection TVS diodes available in the industry. The approximate size of the device is 0.020″ x 0.010″ (0.6mm x 0.3mm or 600um x 300um) and it is built using advanced silicon technology. The product is a surface-mountable Flip Chip with two solder bumps for direct attachment to Printed Circuit Boards. The ESD0201 has superior electrical performance and exceeds the requirements of IEC61000-4-2 level 4. This product offers ESD level in excess of 30kV contact discharge when tested to IEC61000 standards. In spite of the exceptionally high ESD level, this device offers a relatively low input capacitance of under 20 pF.

Mobile computing and consumer products are becoming increasingly susceptible to ESD failures and therefore all tier1 manufacturers are switching to silicon based diode protection. Since they predominantly use integrated circuits (IC) with sub-micron geometries and low working voltages, the traditional high clamp voltage polymers and varistors have become inadequate. ESD0201 offers clamp voltage as low as 10V which virtually eliminates IC latch-up and soft errors.

“At OnChip we are rapidly expanding our product portfolio. This is our fourth major product launch in less than 3 months,” said Ashok Chalaka, President and CEO. “The introduction of the ESD0201 diodes is a significant milestone for OnChip and it clearly establishes us as a market leader. This product offers the smallest form-factor and the highest ESD protection level in the industry. The ultra miniature size, the very high ESD level, the relatively small junction capacitance and low clamp voltage make this part very attractive to system designers.”

Availability and Pricing
The OnChip ESD0201-01FR is available immediately worldwide at $0.07 USD in quantities of 25,000. Developed at OnChip Devices’ Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

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