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OnChip Offers Visual Inspection Services for Wafers or Bare Die
Submounts to Improve Efficiency of HB LED
Low Capacitance Diode Arrays for rf Antenna ESD Protection
Miniature CSP EMI Filter Arrays with ESD Diodes for mobile handsets
Ultra Small ESD Protection Diodes for HB LED
Low Capacitance ESD protection chips for USB Port
OnChip Offers Visual Inspection Services for Wafers or Bare Die
OnChip offers 100% visual inspection using both low and high power microscopes that meet Commercial, Military and Medical Electronics specifications. Inspection is done to look for various types of visual defects.
Submounts to Improve Efficiency of HB LED
Silicon and Ceramic Carriers or Submounts for HB LED (High Brightness Light Emitting Diode), with major advantages of power savings, increased life expectancy and faster response time over traditional bulbs, HB LEDs are rapidly taking over many applications such as LCD backlighting, traffic lights, automotive lighting, camera flash and even standard lighting.
Low Capacitance Diode Arrays for rf Antenna ESD Protection
Packaged in miniature 3-pin SOT23 these ESD diodes are specifically designed to provide contact discharge protection for RF Antennas at levels as high as 8kV when tested to IEC61000-4-2 International Standards.
Miniature CSP EMI Filter Arrays with ESD Diodes for mobile handsets
Electromagnetic interference (EMI) low-pass RC Pi filter arrays with on-board diodes for electrostatic discharge (ESD) protection. Offered in Flip Chip style Chip Scale Packages (CSP), these devices are specifically designed for high-speed data LCD and memory card interfaces in mobile phones, PDAs and MP3 players. They provide superior electrical performance across a wide frequency range as well as significant board space savings.
Ultra Small ESD Protection Diodes for HB LED Wire-bondable miniature silicon ESD protection diode chips targeted for the High-Brightness and Power LED markets. OnChip's ESD devices are built on silicon and offer back-to-back diode topology. They are available either in a single-wire or dual-wire formats. OnChip also offers ESD flip chips consisting of two solder bumps for surface mount application. All devices meet the requirements of IEC61000-4-2 level 4 (air discharge up to 15kV, contact discharge up to 8kV).
Low Capacitance ESD protection chips for USB Port
Low capacitance ESD protection devices for single and dual USB ports. These devices protect the two data lines and the power rail of the USB 2.0 high speed interface. The very low sub-1pF line-capacitance of the new ESD2100-02 and ESD2100-04 ensures minimal distortion of the 480-Mbit/s USB 2.0 signal. These devices offer optimum trade-off between low line-to-ground capacitance and compliance with IEC61000-4-2 level 4 (air discharge up to 15kV, contact discharge up to 8kV).

OnChip Devices, Inc head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With an advanced silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

OnChip's Integrated Passives Devices (IPDs) are ideally suited for high-performance electronic systems that are both cost as well as space sensitive. By combining Resistors, Capacitors and Diodes on the same monolithic silicon substrate, OnChip is providing smaller, cheaper and high performance devices. These value-added products are ideal for high-volume and cost-sensitive applications such Handset, Notebook PCs, MP3 Players and Printers.

Primary applications for OnChip's IPDs are Electro-static Discharge (ESD) Protection as well as Electro-magnetic Interference (EMI) Filtering.

 

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