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OnChip Devices, Inc head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With an advanced silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.
OnChip's Integrated Passives Devices (IPDs) are ideally suited for high-performance electronic systems that are both cost as well as space sensitive. By combining Resistors, Capacitors and Diodes on the same monolithic silicon substrate, OnChip is providing smaller, cheaper and high performance devices. These value-added products are ideal for high-volume and cost-sensitive applications such Handset, Notebook PCs, MP3 Players and Printers.
Primary applications for OnChip's IPDs are Electro-static Discharge (ESD) Protection as well as Electro-magnetic Interference (EMI) Filtering.
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OnChip Introduces Submounts to Improve Efficiency of HB LED![]() OnChip Offers Silicon and Ceramic Carriers or Submounts that greatly improve the performance of High Brightness Light Emitting Diodes Friday, 9 October 2009 Read more |
OnChip Introduces Thin Film Multi-tapped Silicon Chip Resistors for Hi-Rel Applications![]() OnChip Introduces an Extremely Versatile Designer Friendly Thin Film Wire-bondable Silicon Resistor Chips for Medical, Aerospace, Military, Communication and Instrumentation Applications Thursday, 23 April 2009 Read more |
OnChip Devices Introduces Low Capacitance Diode Arrays for rf Antenna ESD Protection![]() Packaged in miniature 3-pin SOT23 these ESD diodes are specifically designed to provide contact discharge protection for RF Antennas at levels as high as 8kV when tested to IEC61000-4-2 International ... Tuesday, 3 March 2009 Read more |
OnChip Introduces Thin Film Precision Silicon Chip Resistors for Hi-Rel Applications![]() OnChip Introduces a family of high reliability Thin Film wire-bonable Silicon Resistor Chips for Medical, Aerospace, Military, Communication and Instrumentation Applications Wednesday, 4 February 2009 Read more |