TVS/ESD Protection
OnChip offers a wide range of diode arrays that deliver outstanding protection against ESD and other voltage-induced transient pulses. These devices protect up to 8 transmission or data lines from spikes of up to 30 kV when tested per IEC-61000. For I/O ports with high data rates, OnChip offers ESD diodes with input capacitances as low as 0.5 pF. Due to their small size and ultra low leakage current these devices are best in class for space critical and power saving applications, including battery powered and handheld appliances.
SMD (Surface Mount) Packaged Zener and TVS Diode Arrays
OnChip Part Number | Package Type | X (mm) | Y (mm) | Z (mm) | Pitch (mm) | # Channels | Breakdown Voltage (V) | ESD Contact (±kV) |
Input Capacitance (pF) |
---|---|---|---|---|---|---|---|---|---|
2.9 | 2.8 | 1.40 | 0.95 | 1 | 1.8 ~ 79 | 8 | |||
ESD0201-5V3 1 file(s) 265.33 KB
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DFN-2 | 0.6 | 0.3 | 0.30 | 0.31 | 1 | 6 | 8 | 3 |
ESD0402-5V3LC 1 file(s) 291.49 KB
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0402 DFN-2 1 file(s) 85.62 KB
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1.0 | 0.6 | 0.46 | 0.65 | 1 | 6 | 20 | 0.6 |
2.2 | 2.0 | 1.00 | 0.65 | 4 | 6 | 8 | 3 | ||
3.0 | 4.9 | 0.95 | 0.50 | 4 | 6 | 8 | 3 | ||
1.6 | 1.6 | 0.55 | 0.50 | 4 | 6 | 8 | 3 | ||
3.0 | 4.9 | 0.95 | 0.50 | 4 | 6 | 8 | 1.4 | ||
0402 DFN-2 1 file(s) 85.62 KB
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1.0 | 0.6 | 0.46 | 0.65 | 1 | 6 | 8 | 0.5 | |
2.5 | 1.0 | 0.60 | 0.50 | 4 | 6 | 12 | 0.8 | ||
2.5 | 1.3 | 0.95 | – | 1 | 6 | 8 | 3 | ||
0402 DFN-2 1 file(s) 85.62 KB
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1.0 | 0.6 | 0.46 | 0.65 | 1 | 12.4 | 30 | 60 | |
2.9 2.9 2.9 3.0 2.0 2.9 1.6 3.0 4.9 3.0 |
2.8 2.4 2.8 4.9 2.2 2.8 1.6 4.9 6.0 4.9 |
1.40 1.00 1.40 0.95 1.00 1.40 0.55 0.95 1.55 0.95 |
0.95 1.90 0.95 0.50 0.65 0.95 0.50 0.65 1.27 0.50 |
1 2 2 4 4 4 4 6 6 8 |
6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 |
8 8 8 8 8 8 8 8 8 8 |
1 1 1 1 1 1 1 1 1 1 |
||
2.0 2.9 2.9 2.0 2.9 2.0 |
2.2 2.8 2.4 2.2 2.8 2.2 |
1.00 1.40 1.00 1.00 1.40 1.00 |
0.65 0.95 1.90 0.65 0.95 0.65 |
2 2 3 4 4 5 |
7.5 7.5 7.5 7.5 7.5 7.5 |
15 15 15 15 15 15 |
15 15 15 15 15 15 |
||
3.0 | 2.75 | 1.00 | 0.95 | 2 | 12.5 | 8 | 3 | ||
2.0 2.9 2.9 2.0 2.9 1.6 1.6 2.0 2.9 1.6 |
2.2 2.8 2.4 2.2 2.8 1.6 1.6 2.2 2.8 1.6 |
1.00 1.40 1.00 1.00 1.40 0.55 0.55 1.00 1.40 0.55 |
0.65 0.95 1.90 0.65 0.95 0.50 0.50 0.65 0.95 0.50 |
2 2 3 4 4 4 4 5 5 5 |
6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 6.5 |
15 15 15 15 15 15 15 15 15 15 |
7 7 7 7 7 7 7 7 7 7 |
||
2.6 | 2.6 | 0.50 | 0.50 | 4 | 6 | 12 | 1.5 | ||
3.0 | 4.9 | 0.95 | 0.50 | 4 | 85 | 8 | 5 | ||
4.9 | 6 | 1.55 | 1.27 | 6 | 6.1 | 15 | 75 | ||
2.9 | 2.8 | 1.40 | 0.95 | 4,5 4,5 4,5 4,5 |
6 13.3 15 24 |
8 | 15 80 50 40 |
||
2.9 2.0 |
2.8 2.2 |
1.40 1.00 |
0.95 0.65 |
4 4 |
6.8 6.8 |
8 8 |
|||
SOD-323F | 2.55 | 1.25 | 0.95 | – | 1 | 1.8 ~ 79 | 8 | ||
1.2 | 1.2 | 0.40 | 0.40 | 6 | 6 | 15 | 4.5 | ||
OC1208-07MR 1 file(s) 136.32 KB
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3.0 | 4.9 | 0.95 | 0.50 | 7 | 5 | 8 | 3 | |
2.0 2.9 3.0 |
2.0 2.8 4.9 |
0.90 1.40 1.00 |
1.30 0.95 0.65 |
2 2 4 |
10 10 10 |
8 8 8 |
0.8 0.8 0.8 |
||
3.0 3.0 |
4.9 4.9 |
0.95 0.95 |
0.65 0.50 |
6 8 |
9 9 |
15 15 |
1.6 1.6 |
||
2.9 | 2.8 | 1.40 | 0.95 | 2 | 7.6 | 12 | 1.5 | ||
1.25 | 1.0 | 0.55 | 0.40 | 4 | 6.1 | 8 | 5 | ||
OC1263-02SE 1 file(s) 462.35 KB
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1.6 | 1.6 | 0.55 | 0.50 | 2 | 10 | 8 | 0.85 | |
4.25 | 2.7 | 2.15 | – | 1 | 6.4 ~ 243.2 | 8 | |||
4.3 | 3.6 | 2.30 | – | 1 | 6.4 ~ 543 | 8 | |||
7.8 | 5.9 | 2.40 | – | 1 | 6.4 ~ 543 | 8 |
Flip Chip Zener Diodes and Arrays
OnChip Part Number | # Bumps | # Channels | X (mm) |
Y (mm) |
Z (mm) |
Breakdown Voltage (V) | ESD Contact (±kV) | Junction Capacitance (pF) | Solder Pad Material |
---|---|---|---|---|---|---|---|---|---|
2 | 1 | 0.4 | 0.2 | 0.18 | 7.5 | 15 | 5 | Sn/Ag/Cu0.5 | |
2 | 1 | 0.6 | 0.3 | 0.25 | 8 | 30 | 17.5 | Sn/Ag/Cu0.5 Ni/Au |
|
10 | 8 | 1.96 | 1.33 | 0.64 | 5.6 | 10 | Sn/Pb Sn/Ag/Cu |
||
2 | 1 | 0.25 | 0.25 | 0.11 | 6 | 8 | Al/1%Si Au |
||
2 | 1 | 0.47 | 0.45 | 0.16 | 25 | 8 | 100 | Al/1%Si Au |
|
2 | 1 | 0.48 | 0.44 | 0.15 | 90 | 4 | 20 | Au | |
4 | 1 | 1.0 | 0.35 | 0.53 | 6,8.5,13.3,16.7,26.7 | 8 | 35,32,30,25,20 |
Bare-die (Wire-bondable) Diodes
OnChip Part Number | Structure | TVS Polarity | Chip Size (µm) | Chip Thickness (µm) |
# Channels | Breakdown Voltage (V) | ESD Contact (±kV) | Solder Pad Material | Back Metal |
---|---|---|---|---|---|---|---|---|---|
N/P/N | Bi | 200×200 | 100, 150, 200 |
1 | 5 | 4 | Al Au |
Ti/Ni/Au Ti/Ag Ti/Ni/AuSn |
|
ESD-8x8-24V 1 file(s) 193.08 KB
|
N/P/N | Bi | 200×200 | 100, 150, 200 |
1 | 20 | 4 | Al Au |
Ti/Ni/Au Ti/Ag Ti/Ni/AuSn |
N/P, P/N | Uni | 800×580 | 220 | 4 | 6.2 | 8 | Al | Ni/Ag | |
N/P, P/N | Uni | 650×350 650×720 650×1110 650×1490 |
100, 150, 200, 225 |
2 4 6 8 |
7 | 15 | Al Au |
Ti/Ni/Au Ti/Ag Ti/Ni/AuSn Ti/Ni/Au/AuSn/Au |
|
P/N | Uni | 250×250 | 100, 150, 200 |
1 | 75 | 8 | Al Au |
Ti/Ni/Au Ti/Ag Ti/Ni/AuSn Ti/Ni/Au/AuSn/Au |
|
P/N | Uni | 400×260 | 100, 150, 200 |
2 | 75 | 8 | Al Ni/Au Pb-free |
Ti/Ni/Au Ti/Ag Ti/Ni/AuSn Ti/Ni/Au/AuSn/Au |
|
ESD20x20-Bi3V 1 file(s) 343.69 KB
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N/P/N | Bi | 530×530 | 100, 150, 200 |
1 | 3 | 15 | Al Au |
Ti/Ni/Au Ti/Ag Ti/Ni/AuSn |
N/P | Uni | 530×430 | 190 | 1 | 2.8 | 8 | Al | Ag | |
P/N | Uni | 380×300 | 200 | 4 | 7 | 15 | Al | Au | |
ESD5959-12V 1 file(s) 339.92 KB
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P/N | Uni | 150×150 | 100 | 1 | 12.5 | 8 | Al | Au |
N/P | Uni | 3050×1520 | 100,150,200,250,300 | 1 | 5.8,7,10.2,12.8,17,33.3,35 | 15 | Al Au |
Ti/Ni/Au Ti/Ag Ti/Ni/AuSn |
|
ESD7979-100V 1 file(s) 510.17 KB
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P/N | Uni | 200×200 | 150 | 1 | 100 | 8 | Al | Au |
N/P | Uni | 200×200 | 100, 150 |
1 | 5 7 |
8 | Al Au |
Au | |
P/N | Uni | 200×200 | 100, 150 |
1 | 5 7 |
8 | Al Au |
Au | |
ESD9595-55V 1 file(s) 509.65 KB
|
P/N | Uni | 240×240 | 100 | 1 | 55 | 8 | Al | Au |