OnChip Introduces a family of high reliability Thin Film wire-bondable Silicon Resistor Chips for Medical, Aerospace, Military, Communication, and Instrumentation Applications

Santa Clara, CA – A global leader in Integrated Passives Devices (IPD), OnChip today introduced a family of Thin Film Silicon wire-bondable Resistor Chips. These products use sophisticated thin-film manufacturing process featuring a high-stability, self-passivating and moisture-resistant Tantalum Nitride resistor element. Consisting of a single and dual value resistors, these chips offer a very wide range of resistances and tolerances. Additionally, these devices provide low shunt capacitance and low-noise operation which are ideal attributes for use in high performance hybrid microelectronics. The single value resistors TX & TL Series Resistors have a very small die size of 20 x 20 mils. Sq.. The TX resistors are offered in single wire bond configuration while the TL requires two wire bonds. The center-tapped TR Series Resistors provide greater flexibility to hybrid circuit designers. Measuring a size of 30 x 30 mils sq., the TR consists of six bond pads enhancing layout flexibility. It also offers users three resistor value choices – total value, one-half value, or one-quarter value – depending on the wire-bond configuration. The TR resistors offer a wide resistance range of 4.7ohms to 1Meg-ohms with tight tolerances down to 0.5% and TCR values as low as 25 ppm/°C. TCR tracking between resistor halves is 5 ppm/°C.

Electrically tested and visually inspected to MIL-STD-883, these silicon resistor chips feature resistance to thermal shock and high-temperature exposure. They are specified for an operating temperature range of -55°C to +125°C. 

Availability and Pricing
TL, TR, and TX thin film resistor chips are available immediately worldwide. These devices have production pricing in the range of $0.24 to $3.25, depending on the device type and volume. While samples of all devices are available immediately, please expect lead-times of 6 weeks for production quantities. Developed at the OnChip Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-key assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing, and Consumer Electronics.