Package Dimensions

Most common packages offered by OnChip. Click on a package to see a drawing with dimensions.

SOIC-8 (4.9mm x 6.0mm x 1.5mm)

1 file(s) 77.89 KB

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SOD-323 (2.5mm x 1.3mm x 1.1mm)

1 file(s) 75.05 KB

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SLP2510P8 (2.5mm x 1.0mm x 0.6mm)

1 file(s) 88.40 KB

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SC70-6 (2mm x 2.2mm x 1mm)

1 file(s) 83.00 KB

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SC70-5 (2mm x 2.2mm x 1mm)

1 file(s) 82.24 KB

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SC70-3 (2mm x 2.2mm x 1mm)

1 file(s) 82.41 KB

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QSOP-24 (8.5mm x 6mm x 1.5mm)

1 file(s) 88.75 KB

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QSOP-16 (4.9mm x 6mm x 1.5mm)

1 file(s) 90.94 KB

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MSOP-10 (3mm x 4.9mm x 1mm)

1 file(s) 81.22 KB

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MSOP-8 (3mm x 4.9mm x 1mm)

1 file(s) 75.49 KB

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OnChip Announces Semiconductor Wafer Fabrication Services

Wednesday, August 03, 2016

OnChip Offers a Full Service Silicon Wafer Backend Processing

Thursday, July 28, 2016

OnChip Offers Semiconductor Wafer Backside Metallization

Friday, June 17, 2016

OnChip Adds Thin Film Resistor and R-C Capabilities for Customer Specific Applications

Wednesday, May 25, 2016

OnChip Devices Releases New Line of TVS diodes in Through Hole and Surface Mount Packages

Friday, July 31, 2015

OnChip Devices Unveils New Line of Zener diodes in Through Hole and Surface Mount Packages

Friday, July 31, 2015

OnChip Devices Unveils New Line of Electrolytic Capacitors for Thru-hole and Surface-mount PC Boards

Wednesday, July 29, 2015

OnChip Introduces Low Voltage Diodes for High-Brightness LED Protection

Tuesday, March 31, 2015

OnChip Introduces New Series of Space Saving Bare-die Zener Diodes for Transient Voltage Suppression

Friday, February 27, 2015

OnChip Introduces a New Family of Flip Chip Resistors for Consumer Electronics Application

Thursday, December 18, 2014