Silicon diodes as small as 8 x 8 mils sq and 4 mils thick offer exceptional Electrostatic Discharge Protection for High Brightness and Power LED

Santa Clara, CA, January 14, 2008 – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced wire-bondable miniature silicon ESD protection diode chips targeted for the High-Brightness and Power LED markets. OnChip’s ESD devices are built on silicon and offer back-to-back diode topology. They are available either in a single-wire or dual-wire formats. OnChip also offers ESD flip chips consisting of two solder bumps for surface mount application. All devices meet the requirements of IEC61000-4-2 level 4 (air discharge up to 15kV, contact discharge up to 8kV).

High Brightness LEDs (HB LED) and High Power White LEDs using InGaN technology are poised to enable a market transition to energy efficient Solid State Lighting (SSL). These LEDs continue to make major inroads into lighting applications that were traditionally dominated by incandescents and other light sources. They can be found in a wide range of applications such as traffic signals, LCD backlights, mobile handset camera flashes, automotive brake lights, architectural lighting, and full-color displays. One of the main drawbacks of the HB-LED products is the fact that they are extremely ESD sensitive. OnChip’s silicon diodes help eliminate this weakness.

OnChip’s ESD-8×8 single-wire ESD diode is only 200 um x 200 um in size and is available in a 100um (4 mils) thickness. The ESD-PL02 is a larger device with an approximate size of 18 x 18 x 6 mils and is designed to handle voltages as high as 28V. The ESD-PL02 is ideally suited for protecting a string of LEDs such as RGB modules.

OnChip recently announced ESD protection solutions for HDMI and USB ports. Other ESD and EMI filter products as well as precision resistor networks are in the pipleline.

Availability and Pricing
The OnChip ESD-8×8 is available immediately worldwide at $0.01 USD in quantities of 50,000. The ESD-PL02 is priced at $0.03 in quantities of 25,000. These components are developed at OnChip Devices’ Santa Clara facility and are produced to the highest quality standards.

About OnChip Devices
OnChip Devices is head-quartered in Santa Clara, CA and is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-keys assembly and test houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

Superior electrostatic discharge protection with ultra-low capacitance now available

Santa Clara, CA, December 12, 2007 – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced low capacitance ESD protection devices for single and dual USB ports. These devices protect the two data lines and the power rail of the USB 2.0 high speed interface. The very low sub-1pF line-capacitance of the new ESD2100-02 and ESD2100-04 ensures minimal distortion of the 480-Mbit/s USB 2.0 signal. These devices offer optimum trade-off between low line-to-ground capacitance and compliance with IEC61000-4-2 level 4 (air discharge up to 15kV, contact discharge up to 8kV).

New generation mobile computing and consumer products are increasingly susceptible to ESD events since they predominantly use integrated circuits (IC) with sub-micron geometries and lower working voltages. Furthermore, portable electronics require lower capacitance to maintain the signal integrity of their high speed I/O ports. Traditional silicon TVS diodes offer low ESD clamping voltage and fast response time, but their large line-capacitance limits their use in high speed applications. Other solutions such as polymers and varistors offer low capacitance, but their high clamp-voltage limits their ability to adequately protect ICs from latch-up after an ESD event thereby causing soft errors.

The introduction of the ESD2100 family of products reflects the increasing use of higher data rates for interfaces in computer and consumer electronics. “USB is the most common port in all Computer Peripherals and Portable Consumer Electronics such as MP3 Players, Digital Cameras and Mobile Handsets.” said Sona Joe, product marketing manager. “The rail-to-rail topology of our ESD2100 provides protection of both upstream and downstream USB 2.0 (full speed) and on-the-go (OTG) ports. The additional ESD diode between the Vcc and Ground prevents charging of the Supply Line.”

Availability and Pricing
The OnChip ESD2100-02 offers 2-channels of ESD protection suitable for a single USB port. It is available immediately worldwide at $0.11 USD in quantities of 10,000. Pricing for the ESD2100-04 with 4-channels of ESD protection suitable for two USB Ports is $0.15. Developed at OnChip Devices’ Santa Clara facility, these components are produced to the highest quality standards.

About OnChip Devices
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-keys assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

OnChip Devices introduces Ultra Low-Capacitance integrated ESD protection chip for HDMI^TM 1.3 Port Protection

Superior electrostatic discharge protection with ultra-low capacitance now available

Santa Clara, CA, November 21, 2007 – OnChip Devices, Inc. today announced the industry’s lowest capacitance ESD protection chip to support the HDMI^TM 1.3 specification. The High-Definition Multimedia Interface^TM is the standard digital interface for high-definition consumer electronics, adopted by more than 700 companies worldwide. Available immediately, OnChip’s highly integrated solution provides a high-level of ESD protection, and is designed to support the latest HDMI 1.3 specification, as well as previous standards such as HDMI 1.2. The OnChip ESD2100 offers ultra-low line capacitance to ensure high signal integrity for video formats such as 1080p.

“OnChip’s ESD2100 family is ideally suited for all high speed I/O Port ESD/TVS protection including the HDMI 1.3 and USB2.0,” said Sona Joe, product marketing manager. “OnChip’s new ESD protection chip delivers superior performance while offering very aggressive pricing, ultra-low line capacitance, and HDMI 1.3 compliance in very small IC package.” The ESD2100 chip delivers up to 8 kV of ESD protection in contact discharge per IEC61000-4-2 standards for up to 8 channels. Total line capacitance for the chip is as low as 0.6 pF, with excellent capacitance matching of less than 0.05 pF for TMDS pairs.

The ESD2100 is offered in various industry standard IC packages to help PCB designers flexibility in routing. Furthermore, the chip design and it’s ultra-low line capacitance enable customers to improve time-to-market of their consumer products.

Availability and Pricing
The OnChip ESD2100-08MR ESD protection chip offers 8-channels of ESD protection and is available immediately worldwide at $0.24 USD in quantities of 10,000. Developed at OnChip Devices in the Santa Clara facility, the OnChip ESD protection chip is produced to the highest quality standards.

About OnChip Devices, Inc.
OnChip Devices head-quartered in Santa Clara, CA is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-keys assembly houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.

Note: HDMI and High-Definition Multimedia Interface are trademarks of HDMI Licensing, LLC in the United States and other countries.