Silicon diodes as small as 8 x 8 mils sq and 4 mils thick offer exceptional Electrostatic Discharge Protection for High Brightness and Power LED
Santa Clara, CA, January 14, 2008 – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced wire-bondable miniature silicon ESD protection diode chips targeted for the High-Brightness and Power LED markets. OnChip’s ESD devices are built on silicon and offer back-to-back diode topology. They are available either in a single-wire or dual-wire formats. OnChip also offers ESD flip chips consisting of two solder bumps for surface mount application. All devices meet the requirements of IEC61000-4-2 level 4 (air discharge up to 15kV, contact discharge up to 8kV).
High Brightness LEDs (HB LED) and High Power White LEDs using InGaN technology are poised to enable a market transition to energy efficient Solid State Lighting (SSL). These LEDs continue to make major inroads into lighting applications that were traditionally dominated by incandescents and other light sources. They can be found in a wide range of applications such as traffic signals, LCD backlights, mobile handset camera flashes, automotive brake lights, architectural lighting, and full-color displays. One of the main drawbacks of the HB-LED products is the fact that they are extremely ESD sensitive. OnChip’s silicon diodes help eliminate this weakness.
OnChip’s ESD-8×8 single-wire ESD diode is only 200 um x 200 um in size and is available in a 100um (4 mils) thickness. The ESD-PL02 is a larger device with an approximate size of 18 x 18 x 6 mils and is designed to handle voltages as high as 28V. The ESD-PL02 is ideally suited for protecting a string of LEDs such as RGB modules.
OnChip recently announced ESD protection solutions for HDMI and USB ports. Other ESD and EMI filter products as well as precision resistor networks are in the pipleline.
Availability and Pricing
The OnChip ESD-8×8 is available immediately worldwide at $0.01 USD in quantities of 50,000. The ESD-PL02 is priced at $0.03 in quantities of 25,000. These components are developed at OnChip Devices’ Santa Clara facility and are produced to the highest quality standards.
About OnChip Devices
OnChip Devices is head-quartered in Santa Clara, CA and is a global leader in Integrated Passive Devices. With it’s own silicon fabrication facility and strong partnerships with full turn-keys assembly and test houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High-brightness LED, Computing and Consumer Electronics.