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OnChip Introduces Low Voltage Diodes for High-Brightness LED Protection | OnChip Devices, Inc. - Global Leader in Integrated Passive Devices

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OnChip Introduces Low Voltage Diodes for High-Brightness LED Protection

OnChip’s Low Voltage Zener Chips Protect High Brightness Light Emitting Diodes from Damage Caused by Transient Voltages and Electrostatic Discharge

Santa Clara, CA – OnChip Devices, a world leader in Integrated Passive Devices (IPD), has introduced a wire-bondable silicon ESD diode chip targeted towards low voltage LED applications. Adding to its broad range of bare-die diode offerings, these Zeners are ideal for protecting circuits by suppressing voltage higher than 3.0 Volts. The ESD2117 diode can handle pulses of up to 350W and 20A, providing protection of 8kV when tested to level 4 of the IEC 61000-4-2 standard. These diodes do not exhibit any device degradation when compared to Multilayer Varistors (MLV). ESD2117 chip diodes are lead-free and RoHS compliant.

High Brightness LEDs (HB LED) and High Power White LEDs are enabling a market transition to energy efficient Solid-State Lighting (SSL). However, LED products are extremely sensitive to electrostatic discharge (ESD) as well as transient voltages. By introducing a Zener diode into the circuit, the LED is protected from surges in voltage that can cause permanent damage. Using a Zener diode is a preventive method to ensure that time and money are saved in the lifespan of the application.

The ESD2117 chip can also be used in multi-chip, RF, and Hybrid microelectronics modules. The small chip size and single wire bond pad make this device ideal for applications with limited board space. A large cross-sectional area of the N-P junction allows the device to conduct high transient currents.

gI_114720_ESD2117 GelPak

ESD2117 diodes are available in a variety of different formats including Gel-Paks (shown above)

The ESD2117 is a 21 x 17 mils chip with 7.5 mil thickness. The top bond pad is large (15 x 11 mils) for easy wire bonding. The chip’s silver back metal allows direct placement onto PCBs, saving space while ensuring high electrical conductivity for a fraction of the cost of gold. Placing two of these diodes back to back will protect the circuit from both AC and DC voltage spikes.

Availability and Pricing
OnChip’s ESD2117 diodes are available immediately in the US and international markets. They can be shipped in undiced 4” wafers (31k units), diced on Mylar tape, or placed in Gel-Paks or Waffle Packs. ESD2117 diodes are designed and manufactured at OnChip Devices’ Santa Clara facility in California, and produced to the highest quality standards.

About OnChip Devices
OnChip Devices is headquartered in Santa Clara, CA and is a global leader in Integrated Passive Devices. With its own silicon fabrication facility and strong partnerships with full turnkey assembly and test houses in Asia, OnChip is offering state-of-the-art silicon and ceramic solutions for High Brightness LED, Computing, and Consumer Electronics.