TVS/ESD Protection

OnChip offers a wide range of diode arrays that deliver outstanding protection against ESD and other voltage-induced transient pulses. These devices protect up to 8 transmission or data lines from spikes of up to 30 kV when tested per IEC-61000. For I/O ports with high data rates, OnChip offers ESD diodes with input capacitances as low as 0.5 pF. Due to their small size and ultra low leakage current these devices are best in class for space critical and power saving applications, including battery powered and handheld appliances.

SMD (Surface Mount) Packaged Zener and TVS Diode Arrays

OnChip Part Number Package Type X (mm) Y (mm) Z (mm) Pitch (mm) # Channels Breakdown Voltage (V) ESD
Contact (±kV)
Input Capacitance
(pF)
2.9 2.8 1.40 0.95 1 1.8 ~ 79 8
DFN-2 0.6 0.3 0.30 0.31 1 6 8 3
1.0 0.6 0.46 0.65 1 6 20 0.6
2.2 2.0 1.00 0.65 4 6 8 3
3.0 4.9 0.95 0.50 4 6 8 3
1.6 1.6 0.55 0.50 4 6 8 3
3.0 4.9 0.95 0.50 4 6 8 1.4
1.0 0.6 0.46 0.65 1 6 8 0.5
2.5 1.0 0.60 0.50 4 6 12 0.8
2.5 1.3 0.95 1 6 8 3
1.0 0.6 0.46 0.65 1 12.4 30 60
2.9
2.9
2.9
3.0
2.0
2.9
1.6
3.0
4.9
3.0
2.8
2.4
2.8
4.9
2.2
2.8
1.6
4.9
6.0
4.9
1.40
1.00
1.40
0.95
1.00
1.40
0.55
0.95
1.55
0.95
0.95
1.90
0.95
0.50
0.65
0.95
0.50
0.65
1.27
0.50
1
2
2
4
4
4
4
6
6
8
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
8
8
8
8
8
8
8
8
8
8
1
1
1
1
1
1
1
1
1
1
2.0
2.9
2.9
2.0
2.9
2.0
2.2
2.8
2.4
2.2
2.8
2.2
1.00
1.40
1.00
1.00
1.40
1.00
0.65
0.95
1.90
0.65
0.95
0.65
2
2
3
4
4
5
7.5
7.5
7.5
7.5
7.5
7.5
15
15
15
15
15
15
15
15
15
15
15
15
3.0 2.75 1.00 0.95 2 12.5 8 3
2.0
2.9
2.9
2.0
2.9
1.6
1.6
2.0
2.9
1.6
2.2
2.8
2.4
2.2
2.8
1.6
1.6
2.2
2.8
1.6
1.00
1.40
1.00
1.00
1.40
0.55
0.55
1.00
1.40
0.55
0.65
0.95
1.90
0.65
0.95
0.50
0.50
0.65
0.95
0.50
2
2
3
4
4
4
4
5
5
5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
15
15
15
15
15
15
15
15
15
15
7
7
7
7
7
7
7
7
7
7
2.6 2.6 0.50 0.50 4 6 12 1.5
3.0 4.9 0.95 0.50 4 85 8 5
4.9 6 1.55 1.27 6 6.1 15 75
2.9 2.8 1.40 0.95 4,5
4,5
4,5
4,5
6
13.3
15
24
8 15
80
50
40
2.9
2.0
2.8
2.2
1.40
1.00
0.95
0.65
4
4
6.8
6.8
8
8
SOD-323F 2.55 1.25 0.95 1 1.8 ~ 79 8
1.2 1.2 0.40 0.40 6 6 15 4.5
3.0 4.9 0.95 0.50 7 5 8 3
2.0
2.9
3.0
2.0
2.8
4.9
0.90
1.40
1.00
1.30
0.95
0.65
2
2
4
10
10
10
8
8
8
0.8
0.8
0.8
3.0
3.0
4.9
4.9
0.95
0.95
0.65
0.50
6
8
9
9
15
15
1.6
1.6
2.9 2.8 1.40 0.95 2 7.6 12 1.5
1.25 1.0 0.55 0.40 4 6.1 8 5
1.6 1.6 0.55 0.50 2 10 8 0.85
4.25 2.7 2.15 1 6.4 ~ 243.2 8
4.3 3.6 2.30 1 6.4 ~ 543 8
7.8 5.9 2.40 1 6.4 ~ 543 8

 

Flip Chip Zener Diodes and Arrays

OnChip Part Number # Bumps # Channels X
(mm)
Y
(mm)
Z
(mm)
Breakdown Voltage (V) ESD Contact (±kV) Junction Capacitance (pF) Solder Pad Material
2 1 0.4 0.2 0.18 7.5 15 5 Sn/Ag/Cu0.5
2 1 0.6 0.3 0.25 8 30 17.5 Sn/Ag/Cu0.5
Ni/Au
10 8 1.96 1.33 0.64 5.6 10 Sn/Pb
Sn/Ag/Cu
2 1 0.25 0.25 0.11 6 8 Al/1%Si
Au
2 1 0.47 0.45 0.16 25 8 100 Al/1%Si
Au
2 1 0.48 0.44 0.15 90 4 20 Au
4 1 1.0 0.35 0.53 6,8.5,13.3,16.7,26.7 8 35,32,30,25,20

 

Bare-die (Wire-bondable) Diodes

OnChip Part Number Structure TVS Polarity Chip Size (µm) Chip Thickness
(µm)
# Channels Breakdown Voltage (V) ESD Contact (±kV) Solder Pad Material Back Metal
N/P/N Bi 200×200 100,
150,
200
1 5 4 Al
Au
Ti/Ni/Au
Ti/Ag
Ti/Ni/AuSn
N/P/N Bi 200×200 100,
150,
200
1 20 4 Al
Au
Ti/Ni/Au
Ti/Ag
Ti/Ni/AuSn
N/P, P/N Uni 800×580 220 4 6.2 8 Al Ni/Ag
N/P, P/N Uni 650×350
650×720
650×1110
650×1490
100,
150,
200,
225
2
4
6
8
7 15 Al
Au
Ti/Ni/Au
Ti/Ag
Ti/Ni/AuSn
Ti/Ni/Au/AuSn/Au
P/N Uni 250×250 100,
150,
200
1 75 8 Al
Au
Ti/Ni/Au
Ti/Ag
Ti/Ni/AuSn
Ti/Ni/Au/AuSn/Au
P/N Uni 400×260 100,
150,
200
2 75 8 Al
Ni/Au
Pb-free
Ti/Ni/Au
Ti/Ag
Ti/Ni/AuSn
Ti/Ni/Au/AuSn/Au
N/P/N Bi 530×530 100,
150,
200
1 3 15 Al
Au
Ti/Ni/Au
Ti/Ag
Ti/Ni/AuSn
N/P Uni 530×430 190 1 2.8 8 Al Ag
P/N Uni 380×300 200 4 7 15 Al Au
P/N Uni 150×150 100 1 12.5 8 Al Au
N/P Uni 3050×1520 100,150,200,250,300 1 5.8,7,10.2,12.8,17,33.3,35 15 Al
Au
Ti/Ni/Au
Ti/Ag
Ti/Ni/AuSn
P/N Uni 200×200 150 1 100 8 Al Au
N/P Uni 200×200 100,
150
1 5
7
8 Al
Au
Au
P/N Uni 200×200 100,
150
1 5
7
8 Al
Au
Au
P/N Uni 240×240 100 1 55 8 Al Au